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Americas, United States, Milpitas

Posted 69 days ago

Senior Optical Packaging Engineer

🏢 PsiQuantum

USD 183K - 200K per year

+2 benefits
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Role Type

🛠️ Engineer / Developer

Role Focus

🏗️ Build Systems

Seniority

🌳 Senior / Lead

Employer Type

🏢 Industry

This role focuses on developing and implementing robust, high-performance fiber-to-chip packaging and scalable assembly processes for optical systems. The engineer ensures high alignment accuracy and works closely with design and manufacturing teams to define requirements, build prototypes, and scale successful designs to high-throughput production lines. This is essential for integrating optical fibers with photonic integrated circuits used in quantum computers.

Key Responsibilities

Develop optical packages and fiber-to-chip alignment schemes that achieve high alignment accuracy and support scalable assembly.

Design, execute, summarize, and analyze experiments and process trend studies to enhance the performance and reliability of optical packaged assemblies.

Establish and update version-controlled Design for Manufacturing requirements and provide feedback to the packaging design team.

Collaborate with manufacturing groups and vendors to transfer and scale successful packaging designs and processes.

Review packaging design Bills of Materials (BOMs) and work with the supply chain team to procure necessary assembly components.

Required Skills

Master’s Degree or above in Engineering, Physics, or Material Science.

10+ years of experience in Photonic Integrated Circuit (PIC) packaging design, qualification, and multi-chip assemblies.

5+ years of experience working with optical fibers and conducting optical measurements.

5+ years of work experience with advanced semiconductor packaging OSAT or EOL vendors.

Experience with Fiber Array Unit (FAU) or optical connector to chip attachment.

Experience with fiber attach tooling and process/flow development.

Experience with Failure Analysis (FA) and 8D failure resolution techniques.

Technology Tags

Integrated photonics

The job focuses on packaging Photonic Integrated Circuits (PICs) used in the quantum computer architecture.

Optical Tech

The role is defined as "Senior Optical Packaging Engineer" requiring deep knowledge of optical fibers and measurements.

Semiconductor tech

Required experience includes working at semiconductor companies and utilizing OSAT for advanced packaging.

Hybrid Systems

The core responsibility is developing robust fiber-to-chip packages, integrating different component types.

On-chip integration

The engineer is responsible for developing and implementing fiber-to-chip packaging for integrated circuits.

Multi-Chip Scaling

A key responsibility is designing scalable packaging processes and handling multi-chip assemblies.

Cryogenic electronics

The engineered photonic components must be compatible with integration into existing cryogenic cooling infrastructure.

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