qubitsok.com
Cut Noise. Work Quantum.
Europe, United Kingdom, Daresbury
•
Posted 172 days ago
🏢 PsiQuantum
Role Type
Role Focus
Seniority
Employer Type
The Senior Optical Packaging Engineer will be responsible for developing and implementing high-performance, robust, and scalable opto-electronic packaging workflows. This role focuses on various chip-based photonic integrated circuits. This work will be conducted at PsiQuantum's UK R&D facility located in Daresbury Lab.
Key Responsibilities
Develop an optical package and fibre-to-chip alignment scheme to ensure high alignment accuracy and scalable assembly.
Help develop packaging prototypes and scalable fibre-to-chip packaging flows and processes.
Review packaging design BOMs and collaborate with supply chain to procure necessary parts for assembly.
Work with internal packaging teams and external vendors to transfer and scale packaging designs and processes based on successful prototypes.
Collaborate with external vendors and suppliers to source required materials and provide feedback on evolving requirements.
Work with external partners to develop advanced opto-electronic packaging solutions.
Required Skills
Master’s Degree or above in Optical Engineering, Physics or equivalent.
3+ years of experience working on PIC packaging design and qualification.
5+ years of experience working with optical fibers and optical measurements.
3+ years of experience working on FAU / optical connector to chip attachment.
Experience with optical data analysis.
Technology Tags
The job is explicitly part of a mission to build "the first real, useful quantum computers."
The company's architecture is based on "silicon photonics," and the role involves packaging "photonic integrated circuits."
The role directly contributes to building "useful quantum computers" by developing and implementing "optical packaging" for their hardware components.
The job description explicitly states the company leverages "high-volume semiconductor manufacturing processes" for its silicon photonics components.
The core responsibilities revolve around "optical packaging," "optical fibers," and "optical measurements" for photonic integrated circuits.
The role specifically involves developing "fibre-to-chip alignment" and packaging "chip-based photonic integrated circuits," which are forms of on-chip integration.
The role's focus on "fibre-to-chip alignment" and "optical connector to chip attachment" is directly about creating "quantum interfaces" between hardware components.