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Americas, United States, Milpitas

Posted 115 days ago

Senior Integration & Test Engineer (Optomechanical, Thermal)

🏢 PsiQuantum

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Role Type

🛠️ Engineer / Developer

Role Focus

🏗️ Build Systems

Seniority

🌿 Experienced
🌳 Senior / Lead

Employer Type

🏢 Industry

This Senior Integration & Test Engineer joins the Packaging Design team to focus on the design, development, and integration of photonics and optoelectronics packaging. The primary goal is leading the evaluation of these designs through qualification and acceptance testing of chips, electronics, and integrated subassemblies. This role involves designing and executing tests, processing data, characterizing materials, and performing root cause investigations to ensure product reliability.

Key Responsibilities

Design and execute tests using statistical analysis techniques for components up to integrated subassemblies.

Perform hands-on testing across thermal, optomechanical, and materials domains in various environments.

Interpret and evaluate design options based on optical, thermal, electrical, and mechanical metrics.

Validate Finite Element Analysis (FEA) models to ensure accuracy.

Guide the assembly process development to meet all performance requirements.

Conduct reliability testing, root cause analysis, and implement corrective actions for prototype and production devices.

Required Skills

Expertise in Finite Element Analysis (FEA)

Expertise in Failure Modes and Effects Analysis (FMEA)

Experience in data acquisition tools and techniques, including sensors and instrumentation

Experience in failure analysis methods and tools, including root cause analysis and corrective actions

Ability to collaborate across multiple engineering disciplines

Ability to communicate complex results and issues clearly and concisely

Nice-to-have Skills

Experience in vacuum and cryogenic environments

Technology Tags

Photonics

The entire architecture is based on silicon photonics, and the engineer works on photonics packaging.

On-chip integration

The role is specifically dedicated to the integration of photonics and optoelectronics packaging.

Cryogenic & vacuum

Experience in vacuum and cryogenic environments is preferred, aligning with the system's cryogenic cooling architecture.

Device modelling

The engineer is required to validate Finite Element Analysis (FEA) models used in packaging design.

Noise & benchmarking

The role focuses on qualification, acceptance testing, reliability testing, and performance requirements validation.

Semiconductor theory

The job involves integration and testing of components produced at Tier-1 semiconductor fabs using high-volume processes.

Statistics & probability

The role requires the engineer to design and execute tests using statistical analysis techniques such as DoE.